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Date: 2025/01/08
Document No. 11400000721
Title: Sixxon Tech. Co., Ltd. 1st Unsecured Convertible Bond will be listed on the TPEx from January 15, 2025.
Description: 1. Issuer: SIXXON TECH. CO., LTD.
2. Bond name: Sixxon Tech. Co., Ltd. 1st Unsecured Convertible Bond
(1) Code: 45691
(2) Issue amount: TWD 500 million
(3) Issue price: 105.25% (TWD 105.25)
(4) Issue date: January 15, 2025
(5) Maturity date: January 15, 2028
(6) Tenor: 3 years
(7) Coupon rate: 0%
3. For the full terms and conditions of the Bond, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index).
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