1. Issuer: RADIUM LIFE TECH. CO., LTD.
2. Bond Name: RADIUM LIFE TECH. CO., LTD. 3rd Secured Corporate Bond Issue in 2025
(1) Code: B87113
(2) Issue amount: TWD 1 Billion
(3) Issue price: 100%
(4) Issue date: December 24, 2025
(5) Maturity date: December 24, 2028
(6) Tenor: 3 years
(7) Coupon rate: 1.9%
(8) The bond is subject to selling restrictions.
3. For the full terms and conditions of the bonds, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index).
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