1. Issuer: SUNFLEX TECH. CO., Ltd.
2. Bond name: SUNFLEX TECH. CO., LTD. 2nd Secured Convertible Bond
(1) Code: 33902
(2) Issue amount: TWD 200 million
(3) Issue price: 112.55% (TWD 112.55)
(4) Issue date: February 21, 2025
(5) Maturity date: February 21, 2028
(6) Tenor: 3 years
(7) Coupon rate: 0%
3. For the full terms and conditions of the Bond, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index).
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